Logo Made in Germany CIOE 2017


Booth number: 1A13-11

About us

Finetech is a developer and manufacturer of innovative equipment solutions for a variety of micro assembly applications. Due to their modular architecture, the manual, semi-automated and full-automatic systems offer maximum process flexibility for high-precision flip chip assembly and die attach. Finetech partners with customers on their journey from product conception to full production.

Served industries include optoelectronics, data communications, medical/bio technology, aerospace, automotive, semiconductor, defense, as well as education and research. Finetech responds flexibly to specific requirements and offers tailor-made solutions to highly-demanding customer applications.

The company is represented by direct subsidiaries in its core markets and offers on-site application support and advice. It is also represented world-wide by a network of agencies. Finetech is headquartered in Berlin, with subsidiaries in Shanghai, Arizona, New Hampshire, Penang and Tokyo.

Products and services

On display are a selection of sub-micron die bonders for R&D, prototyping and full production. Highlighted topics include the precision assembly of optical transceivers and other opto-electronics and photonics applications.
Opto-Bonder<sup>®</sup> - Automated Optical Device Bonder

Opto-Bonder® - Automated Optical Device Bonder

The Opto-Bonder® is a fully automated bonding platform for photonic applications in process devlopment and production. The Vision Alignment System is combined with automatic pattern recognition for high-precision alignment and bonding results.

FINEPLACER<sup>®</sup> femto 2 - Automated Prototype2Production Bonder

FINEPLACER® femto 2 - Automated Prototype2Production Bonder

The new FINEPLACER®femto 2 is a fully automated sub-micron die bonder for advanced packaging applications. A complete machine enclosure ensures highly stable and fully controlled processes with the focus on maximum yield. Due to a modular system architecture, the FINEPLACER® femto 2 can be configured for a wide range of applications and processes in product development and production.

 FINEPLACER<sup>®</sup> lambda - Flexible Sub-micron Die Bonder

FINEPLACER® lambda - Flexible Sub-micron Die Bonder

The flexible FINEPLACER® lambda is a manual sub-micron die-bonder for precision die attach and advanced chip packaging. It is the premier choice for maximum technological versatility and fast process implementation in R&D and prototyping.


Boxberger Str. 14
12681 Berlin

Phone: +49 30 936681-0
Fax: +49 30 936681-144

Robin Liu
General Manager, Finetech Shanghai Co. Ltd.
Phone: +86 21 5866 1668

Finetech Shanghai Co. Ltd.
Futexiyi Road 355
200131 Shanghai
P.R. China

Phone: +86 21 58661668
Fax: +86 21 58680005

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