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AMICRA Microtechnologies GmbH

展位号: 1A13-5


AMICRA Microtechnologies is a worldwide leading supplier of Die Attach Equipment specializing in submicron placement accuracy (+/- 0.5µm@3sigma). Equipment offering supports Die Attach and Flip Chip bonding processes including the following capability: in-situ eutectic bonding, dynamic alignment, heated tool, pulse heating, laser heating, volumetric and jet dispensing, active bond force control, high speed solutions, in-situ UV curing, 550x600mm bonding area, quantitative tilt calibration system, etc. Market focus: Opto, Silicon Photonics, AOC, VCSEL, Laser Diode, WLP, 2.5D/3D IC, TSV, TCB, Fan-out/EWLP. Other products include: High Speed Wafer Inking and inspection, Automated LED/LD Test & Sort Systems, Gel Fill Line and Custom Solutions.


AFC Plus

AFC Plus

AMICRA's fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (+/- 0.5 µm), a cycle time of <15 sec. as well as a modular machine concept, a flip chip option and much more.


AMICRA Microtechnologies GmbH
Marie-Curie-Str.6, Building 40
93055 Regensburg

电话: +49 941 2082090

Johann Weinhändler
Managing Director
电话: +49 941 2082090

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展位号: 1A13-4